Flying Probe
Our Flying Probe Tester represents the latest frontier in flying probe test technology. It’s vertical architecture optimizes test time by probing both sides of the UUT simultaneously. The tester accommodates a wide range of solutions like vectorless and in-circuit, programming and functional, boundary scan, medium/high volumes of CCA (circuit card assembly) testing, highly-integrated prototypes, high-mixed products, boards not designed for testing, reverse engineering, and repair.
3D AOI
The 3D AOI system in our facility measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI. The machine offers true measurement of the 3rd dimension; flags and quantifies all defects; has intuitive programming using 3D measurements; total IPC 610 compliance solution; and the perfect warp compensation solution.
COMPACT Line
THE COMPACT LINE IS THE IN-CIRCUIT AND FUNCTIONAL TEST PLATFORM DESIGNED MEETING THE REQUIREMENTS OF THE SO CALLED “LEAN PRODUCTION”
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Based on Seica’s VIP platform, the Compact series has been designed to maximize configurability to meet the most diverse test requirements, allowing the user to choose the configuration which best suits the application: in-circuit tester, functional test bench or a completely automated test solution which can be integrated directly in the production line. Spare parts are shared across the platform, keeping maintenance costs to a minimum.