Selective Solder
Our selective soldering systems are based on a modular platform. Depending on the application and on the throughput requirements called for, additional flux, preheat and solder modules can be integrated into the system. In the maximum configuration level, the system can, therefore, operate with up to three solder modules, and each of these modules can again be configured with two mini-wave solder baths. In total, up to 6 mini-wave solder bath can be installed in a system, and each solder module can be preceded by a preheating unit.
Printer
The Professional printing system we use is one of the world‘s most successful high-performance printers. It stands for unprecedented functionality and ensures a production quality at the highest level. Using newest servo drives for all relevant movements including integrated linear scales is leading to the best-in-class alignment repeatability and process capability.
Feeder
The feeder is used to load bare boards for printing or marking into SMT production lines. The PCB stack is manually loaded into the machine and the individual PCBs are handed over to the downstream system on a transfer conveyor. The stack is processed from above which ensures gentle separation of the PCBs. The machine can be equipped with various methods of separation depending on the type of PCB used. It features product parameters that can be changed during an operation and has product memory features to remember the parameters of a job order.
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3D Solder Paste Inspection
Our 3D solder paste inspection machine delivers 3x faster inspection without compromising performance and accuracy. Using patented dual projection, the system eliminates the critical Shadow problem that all 3D SPI systems can be vulnerable to. Additionally, our model has solved the PCB Warp problem that seriously impacts inspection accuracy and reliability of the result. It offers the best inspection speed without compromising accuracy; has field-proven process optimization; patented shadow free moiré technology; and perfect PCB warp compensation
ASM SMT
The Placement Systems we use are the standard for applications that require optimum speed and precision. It offers maximum productivity with its top notch speed, minimal dpm rates, constant 01005 capacity, and continuous changeovers. It may come with 2, 3, or 4 gantries, but additional gantries may be added or removed whenever the need for it arises.
The SIPLACE manufacturing company offers a point of comparison with the other machines, and it gives a view of how the X-series optimizes your specific production processes, and how much the benefits are to your applications. It has the ability to place 150,000 components per hour. The machine is able to recognize the collinearity of components and whether it is in the upright position. Our machine is able to also identify the lead width and length.
Reflow Oven
Our reflow machines are from a family of high-throughput convection reflow ovens which are widely recognized as the global standard of excellence for SMT solder reflow, semiconductor packaging and LED packaging and assembly. Our reflow ovens provide optimized lead-free processing for the ultimate in productivity and efficiency. The exclusive closed-loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption. With 6, 8, 10 and 12-zone air or nitrogen models, 350oC maximum temperature and a comprehensive menu of options, Our reflow ovens are the industry’s most versatile performers and best value.
